TrendForce's latest survey shows that the HBM4's per-foot speed should be increased to 10Gbps as AMD will launch the MI450 Helios platform in 2026, and NVIDIA recently requires Vera Rubin server rack key component suppliers to increase product specifications. Although there are still changes in the specifications that can be improved, SK Hynix HBM4 should maintain the maximum supplier advantage in the early stages of mass production.
HBM4 is an AI server key component, and the transmission speed and frequency width are also the key points of specification improvement. The base die is an important unit that affects the transmission speed of HBM. With the three major suppliers, Samsung will upgrade the HBM4 base grain process to 4 nanometers in 2024, aiming to produce at the end of the year, with a transfer speed of up to 10Gbps, and the proportion of 10Gbps product production is higher than its competitors SK Hynix and Micron.
TrendForce said that in addition to trying to improve the HBM4 specification, NVIDIA mainly considers the supply capacity. If the supply is too small, or the new specifications excessively push up energy consumption or cost, NVIDIA may give up upgrades, or classify platform products, and different suppliers will be divided into different suppliers in different parts levels. In addition, it is not ruled out that after NVIDIA opens the first batch of supplier certification, it provides other operators with more time to adjust to perform the second stage certification. This strategy will affect the post-production increase rate of Vera Rubin platform.
Analyzing the proportion of NVIDIA HBM4 suppliers in 2026, TrendForce believes that based on the established partnership between 2024 and 2025, as well as the technological maturity, reliability and capacity scale, SK Hynix will remain the largest supplier next year, and the supply ratio of Samsung and Micron will be determined based on the subsequent product delivery performance.